Electronic packaging materials prepared by powder injecting molding and pressure infiltration proces

• 作 者: YIN Fazhang GUO Hong JIA Chengchang XU Jun ZHANG Ximin ZHU Xuexin
• 机 构: National Engineering and Technology Research Center for Nonferrous Metals Composites, Beijing Genera
• 出 处: 稀有金属（英文版）
• 发表日期: 2007年6期
• 关键词: composites aluminum microstructure thermal conductivity

AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder injection molding (PIM) and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained by pre-sintering process at 1150 K have high strength and good appearance, and the ratio of open porosity to total porosiry is nearly 98%. The relative density of composites is bigger than 99%. The thermal conductivity of AlSiCp composites fabricated by this method is 198 W·m-1·K-1, and the coefficient of thermal expansion (CTE) is 8.0 × 10-6/K (298 K).