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十一、装架工艺装架工艺实际上是一个装配性质的工艺。它的任务是把带有数十个、数百个到上千个管芯(电路)的大硅片切割成只有单个管芯(电路)的小硅片;并挑出性能好的管芯(电路)装配到底盘上,使管芯和底盘之间有一个良好的欧姆接触和一个很好的散热通路。整个装架工艺步骤可分为管芯(电路)测试、划片、烧结、引线键合四步。装架工艺的质量直接和器件的稳定性和可靠性相联系,为了确保器件的稳定性、可靠性,装架工艺的质量问题要充分地重视。
Eleven, rack technology Racking process is actually an assembly process. Its mission is to cut large silicon wafers with tens, hundreds and thousands of dies into small wafers with a single die (circuit) and pick out a good die Circuit) to the chassis so that there is a good ohmic contact between the die and the chassis and a good thermal path. The entire rack process steps can be divided into die (circuit) testing, dicing, sintering, wire bonding four steps. The quality of the mounting process is directly related to the stability and reliability of the device. In order to ensure the stability and reliability of the device, the quality of the mounting process should be given sufficient attention.