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提出一种检测和修复有缺陷TSV的内建自测试(BIST)和内建自修复(BISR)的方法。采用BIST电路测试TSV,根据测试结构,采用BISR电路配置TSV映射逻辑,有故障的TSV可被BISR电路采用TSV冗余修复。所提出的设计可减小TSV测试价格,并减少TSV缺陷引起的成品率损失。电路模拟表明,面积代价和时间代价是可接受的。
A method to detect and repair BIST and BISR in defective TSV was proposed. The BIST circuit is used to test the TSV. According to the test structure, the BISR circuit is used to configure the TSV mapping logic. The faulty TSV can be repaired by the BISR circuit using TSV redundancy. The proposed design reduces the TSV test price and reduces yield loss due to TSV defects. Circuit simulations show that area and time costs are acceptable.