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针对厚膜DC/DC电源的散热问题,基于实测结果,利用有限元法建立了其三维有限元模型,并模拟出实际工作条件下的温度场分布。分析了电源模块中发热元件的温升及相互的热耦合情况,研究了外壳与基板材料的选择对功率器件温度的影响。分析结果表明,选用导热系数大的外壳和基板材料都有利于降低芯片温度,基板的最佳厚度介于0.6～1.0 mm之间。
Aimed at the problem of heat dissipation of thick film DC / DC power supply, based on the measured results, the finite element method was used to establish the three-dimensional finite element model and to simulate the temperature field distribution under the actual working conditions. The temperature rise and mutual thermal coupling of the heating elements in the power module are analyzed. The influence of the selection of the shell and the substrate material on the temperature of the power device is studied. The analysis results show that the selection of the shell and substrate materials with large thermal conductivity will help reduce the chip temperature, the optimal thickness of the substrate is between 0.6 ~ 1.0 mm.