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采用光电化学方法现场测量铜电极的开路光电压，研究铜在模拟海水３％ＮａＣｌ溶液中的腐蚀行为及缓蚀剂ＰＴＤ对铜的缓蚀行为．实验发现，在３％ＮａＣｌ溶液中铜电极随浸泡时间的延长其开路光电压由正变负即光响应由ｐ型光响应转变为ｎ型光响应，这表明铜表面受到Ｃｌ－的严重侵蚀．加入缓蚀剂ＰＴＤ后，当ＰＴＤ的浓度小于６×１０－５％时，铜电极的光响应转型时间较不加ＰＴＤ时提前．当ＰＴＤ的浓度大于６×１０－５％时，铜电极的光响应不存在转型情况，表明ＰＴＤ产生了良好的缓蚀作用．在本文条件下，ＰＴＤ产生缓蚀作用的最佳浓度为１×１０－４％．
The photoelectrochemical method was used to measure the open circuit voltage of copper electrode in situ. The corrosion behavior of copper in simulated seawater 3% NaCl solution and the corrosion inhibition of copper by corrosion inhibitor PTD were studied. The experimental results show that the photocathode voltage changes from positive to negative, that is, photoresponse from p-type photoresponse to n-type photoresponse, in the 3% NaCl solution as the immersion time prolongs, indicating that the copper surface is seriously attacked by Cl-. When the concentration of PTD is less than 6 × 10-5%, the photoresponsive transition time of copper electrode is earlier than that of PTD without PTD. When the concentration of PTD is more than 6 × 10-5%, there is no transition in the photoresponse of the copper electrode, indicating that PTD has a good corrosion inhibition effect. Under this condition, the optimum concentration of PTD for corrosion inhibition is 1 × 10-4%.