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据《中国电子报》2004年第96期报道,韩国Hynix(现代)半导体公司和欧洲意法半导体公司正式签署协议,共同出资20亿美元,注册资本7.5亿美元,在无锡出口加工区建设月产2万片(未来达到月产6万片)8英寸晶圆生产线、月产1.7万片12英寸晶圆生产线各一条。从事记忆体芯片(线宽0.13um以下)制造、封装和测试(全工序)。据悉,未来Hynix将进一步考虑在无锡建设另一条8英寸或12英寸的晶圆制造生产线,在无锡建成HyniX在海外的重要生产基地和研发中心。
According to the “China Electronics News” No. 96 in 2004 reported that South Korea Hynix (Hyundai) Semiconductor Company and the European company of STMicroelectronics formally signed an agreement to jointly fund 2 billion US dollars registered capital of 750 million US dollars in the construction of export processing zones in Wuxi monthly 20,000 (in the future to reach 60,000 per month) 8-inch wafer production lines, producing 17,000 12-inch wafer production line each one. Engaged in memory chips (line width 0.13um below) manufacturing, packaging and testing (all processes). It is learned that in the future, Hynix will further consider the construction of another 8-inch or 12-inch wafer manufacturing line in Wuxi and build an important overseas production base and R & D center of Hynix in Wuxi.