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为了解决印制电路板的热翘曲,提高电子产品的可靠性。本文对印制电路用的基板即低质覆铜箔的热翘曲即板子受热后所产生的弯曲或扭曲问题进行探讨。
In order to solve the thermal warpage of printed circuit boards, improve the reliability of electronic products. In this paper, printed circuit board that is low thermal conductivity of copper foil that warp or warp caused by bending the board after the issue.