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一、问题的提出半导体器件已进入超大规模集成电路的新阶段,我国亦有大规模集成电路的产品,并为超大规模集成电路的生产作准备。超大规模集成电路的线宽约1微米,大规模集成电路的线宽约3微米;前者在几毫米见方的芯片上一般有上万个门电路,几万个元件,后者也有上千个门电路,几千个元件。但是,引线的数目仍维持在40至60根之间,特殊的也不超过100根。目前的大规模集成电路测量系统,无论中测和成测,都是利用接触式机械探针或管脚插座,检测对特定波形或图形的反应,亦即通常所谓直流、交流和功能测量法。这些方法不能接触到每个门,更不用说要接触到每个元件了。此外机械探
First, the issue put forward Semiconductor devices have entered a new stage of VLSI, China also has large-scale integrated circuit products, and preparation for the production of VLSI. Large-scale integrated circuit line width of about 1 micron, large-scale integrated circuit line width of about 3 microns; the former in a few millimeters square chips generally have tens of thousands of gates, tens of thousands of components, which also have thousands of doors Circuits, thousands of components. However, the number of leads is still between 40 and 60, not more than 100 in particular. Current large-scale integrated circuit measurement system, both in the measurement and the test, are the use of contact mechanical probe or pin socket to detect the response to a particular waveform or graphics, which is commonly referred to as DC, AC, and functional measurement. These methods do not have access to each door, let alone access each component. In addition to mechanical exploration