Thermal Resistance Testing Technology Research of Integration High Power-LED

• 作 者: Ping Xue Chang-Hong Jia Xu-She
• 机 构: Optic&,ElectronicEngineeringResearchCenter
• 出 处: 哈尔滨工业大学学报：英文版
• 发表日期: 2013年2期
• 基金项目: Sponsored by the Heilongjiang Provincial Project （Grant No. 12511121 ）, the Harbin City Innovation Talent Project （Grant No. 2011RFXXGO19 ）, the National Science and Technology Support Project（ Grant

In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the pri