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美国国防部已制订了MIMIC(微波/毫米波单片集成电路)研制计划,以便用GaAs集成电路来补充将在未来的灵巧武器系统中应用的超高速集成电路(VHSIC).就象硅基VHSIC装置极大地提高了新武器系统的中央处理功率一样,GaAs装置由于能在前端处理机中提供可观的处理速度,因而可能有一重大突破.
The U.S. Department of Defense has developed a MIMIC (microwave / millimeter wave monolithic integrated circuit) development program to supplement GaAs integrated circuits with VHSICs that will be used in future smart weapon systems. Like the silicon-based VHSIC Devices have greatly increased the central processing power of new weapon systems. GaAs devices may make a major breakthrough due to their considerable processing speed in front-end processors.