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概述了导通孔填充镀铜技术的应用和工艺条件,贯通孔填充和Si贯通电极(TSV)填充等其它的填充镀铜技术和今后的展望。
The application and process conditions of through-hole filling copper plating technology, other filling copper plating technologies such as through-hole filling and TSV filling are summarized.