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在半导体材料切割机上运用液体、气体静压技术是国外近年来的趋势。它使材料切割机具有精度高,运动平稳,噪声小等特点,能显著提高半导体器件前工序的质量并为后工序创造良好的条件。1445所研制了能够切割φ100直径的半导体材料的QP-3型立式内圆切片机。该机为了自动取片需要大直径中空的主轴,为了满足整机的要求及提高设备精度,QP-3型立式内圆切片机采用了大直径(径向支承直径φ240mm,止推支承平均直径φ270mm)、高转速(主轴转速为2100转/分,径向支承线速度为26.4米/秒,止推支承平均线速度为30米/秒)的液体静压支承的主轴。该主轴静压系统采用了单独供油的止推支承和径向支承,两
In the semiconductor material cutting machine on the use of liquid, gas static pressure technology is the trend in recent years abroad. It makes the material cutting machine with high precision, smooth movement, low noise and other characteristics, can significantly improve the quality of semiconductor devices before the process and create good conditions for the post-process. 1445 has developed a QP-3 vertical internal circular microtome capable of cutting φ100 diameter semiconductor material. In order to automatically pick up the film requires a large diameter hollow spindle, in order to meet the requirements of the machine and improve equipment accuracy, QP-3 vertical internal circular microtome with a large diameter (radial support diameter φ240mm, thrust bearing average diameter φ270 mm), high speed (spindle speed of 2100 rev / min, radial support line speed of 26.4 m / s, thrust support average linear velocity of 30 m / s) hydrostatic bearing spindle. The spindle static pressure system uses a separate oil supply thrust bearing and radial bearings, two