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对热压法与直接敷铜(direct bonded copper,DBC)法制备的2种不同界面状态的AlN/Cu基板进行了物相、形貌和成分及结合力(剥离强度)测试。结果表明:热压法所得复合基板在AlN陶瓷表面有一层约2μm厚的Ti中间层,Ti不仅能与AlN反应生成Ti_2N与Ti_9Al_(23),又能与Cu形成Cu_4Ti_3合金,且Ti与AlN的结合力低于Ti与Cu的结合力;DBC法在AlN陶瓷表面氧化形成一层约2μm厚的Al_2O_3层,Al_2O_3与Cu–O通过共晶液相反应形成CuAlO_2,达到牢固结合,但由于Al_2O_3与AlN的热膨胀系数不匹配,Al_2O_3与AlN的结合力低于Al_2O_3与Cu的结合力;采用DBC法制备的AlN/Cu基板剥离强度(7.94 N/mm)较热压法(2.03 N/mm)高,约是热压法的4倍,且在使用过程中不易失效,适合于苛刻使用条件下的长期应用。
The phase, morphology, composition and bonding strength (peel strength) of AlN / Cu substrates prepared by hot pressing method and direct bonded copper (DBC) method were tested. The results show that the composite substrate obtained by hot pressing has a layer of Ti intermediate about 2μm thick on the surface of AlN ceramic. Ti can react with AlN to form Ti_2N and Ti_9Al_ (23) and Cu_4Ti_3 alloy with Cu, and Ti and AlN The binding force is lower than that of Ti and Cu; the DBC method forms a layer of Al 2 O 3 about 2 μm thick on the surface of AlN ceramics, and CuAlO 2 is formed by the reaction of Al 2 O 3 with Cu- AlN thermal expansion coefficient does not match, Al_2O_3 and AlN bond strength is lower than the binding force of Al_2O_3 and Cu; AlN / Cu substrate prepared by DBC method peel strength (7.94 N / mm) than the hot pressing method (2.03 N / mm) high , About 4 times the hot pressing method, and is not easy to use in the process of failure, suitable for long-term use under harsh conditions of use.