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利用有限元模型分别研究了回流过程和工作过程中传导冷却高功率半导体激光器的正应力、切应力和形变,并借助理论公式分析了热应力和smile的产生原因和分布规律.分析表明,在回流过程中热膨胀系数不匹配造成的切应力是正应力和变形的根源,而在工作过程中,热膨胀系数不匹配和温度梯度共同影响着热应力和变形.在此基础上,将回流导致的剩余应力和变形作为初始条件施加在有限元模型上,对工作状态器件的热应力和smile进行模拟,以获得更精确的模拟结果.最后,通过有限元模型和实验手段研究了不同热沉温度对smile的影响.结果表明,工作过程会导致器件的smile增大,热沉温度的升高也会造成smile进一步增大.
The finite element model was used to study the normal stress, shear stress and deformation of the conduction cooling high power semiconductor laser during the reflow process and the working process respectively. The causes and distribution of thermal stress and smile were analyzed by theoretical formula. In the process of thermal expansion coefficient mismatch caused by the shear stress is the source of normal stress and deformation, and in the course of the work, the thermal expansion coefficient does not match the temperature gradient and thermal stress and deformation together.On this basis, the residual stress caused by reflow and Deformation as an initial condition imposed on the finite element model to simulate the thermal stress and smile of the working state device to obtain more accurate simulation results.Finally, the effect of different heat sink temperature on smile is studied by means of finite element model and experimental methods The results show that the work process will lead to the increase of smile, and the increase of heat sink temperature will cause smile to further increase.