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随着半导体器件塑料封装工艺的发展,越来越多成本低廉的塑封器件代替了成本昂贵的金属和陶瓷封装器件.环氧模塑料就是用来封装这些器件的.这种塑料经过几年来的不断改进,材料的耐热性、防潮性和纯度等各项指标有了很大的提高.在国外,它已基本上取代了其它种类的模塑料(如硅酮塑料);在国内,也已研制出相应的产品,并开始投入使用.本文介绍一下这种模塑料的组成、固化机理和它的性能.
With the development of plastic packaging technology for semiconductor devices, more and more low-cost plastic packaging devices have replaced expensive metal and ceramic packaging devices. Epoxy molding compounds are used to encapsulate these devices. After several years of continuous development Improvement, material heat resistance, moisture resistance and purity and other indicators have been greatly improved in foreign countries, it has basically replaced other types of molding materials (such as silicone plastic); in China, has also been developed The corresponding product, and began to put into use.This article describes the composition of this molding compound, curing mechanism and its performance.