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英飞凌科技股份公司和半导体封装和测试公司日月光半导体制造股份有限公司(ASE)近日宣布,双方将合作推出更高集成度半导体封装,可容纳几乎无
Infineon Technologies AG and semiconductor packaging and test company ASE Semiconductor Manufacturing Co., Ltd. (ASE) announced today that both companies will cooperate to introduce a more integrated semiconductor package that can accommodate almost no