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采用电子背散射衍射(EBSD)技术研究了晶粒尺寸不同的纯Cu试样经冷轧变形和高温退火后的晶界特征分布(GBCD).结果表明,细晶(约12μm)试样经小变形冷轧后在高温短时退火过程中形成了比例高达75.7%的∑3~n(n=1,2,3)特殊晶界,而且具有∑3~n(n=1,2,3)取向关系的特殊晶粒团的平均尺寸较大,达到200μm,试样的GBCD得到较好优化;随着原始晶粒尺寸的增大,试样经冷轧退火后,其特殊晶界比例和特殊晶粒团尺寸均显著减小.EBSD原位观察、孪晶过滤(twinfiltering)和五参数法(FPM)分析表明,三叉晶界(triple.junctions)是轧制退火过程中非共格∑3晶界的有利形核位置,非共格∑3晶界的迁移反应可促进GBCD的优化,这是细晶试样经轧制退火后,其GBCD得到较好优化的关键原因.
The electronic backscatter diffraction (EBSD) technique was used to study the grain boundary characteristic distribution (GBCD) of pure Cu samples with different grain sizes after cold rolling deformation and high temperature annealing.The results show that the fine grain (about 12μm) After deformation and cold rolling, Σ3 ~ n (n = 1, 2, 3) special grain boundaries with a ratio of up to 75.7% were formed during high temperature short time annealing, and Σ3 ~ n (n = The average size of the special grain size of the orientation relationship is larger, reaching 200μm, the GBCD of the sample is optimized; with the increase of the original grain size, the specific grain boundary proportion and special The size of the grains decreased significantly.EBSD in situ observation, twinfiltering and five-parameter method (FPM) analysis showed that the triple junctions were non-coherent Σ3 crystal In the favorable nucleation sites, the migration of non-coherent Σ3 grain boundaries can promote the optimization of GBCD. This is the key reason for the better GBCD refinement of the refined samples after rolling and annealing.