论文部分内容阅读
采用化学镀铜法对金刚石进行表面包覆,得到了不同铜和金刚石质量比的复合粉末,再通过进行放电等离子烧结(SPS),最终得到高金刚石体积百分含量(70vol%)的铜/金刚石复合材料。结果表明:化学镀铜包覆能明显改善所得烧结体中金刚石的分布情况;该复合材料的致密度有所提高,当金刚石体积分数达到70%时,其致密度在97.5%左右,并最终使其热导率上升,最高热导率为404W/m.K。
The surface of the diamond was coated by electroless copper plating to obtain the composite powder with different mass ratios of copper and diamond, and then the spark plasma sintering (SPS) was carried out to finally obtain the high diamond volume percentage (70vol%) of copper / diamond Composites. The results show that the electroless copper plating can obviously improve the distribution of diamond in the obtained sintered compact. The density of the composite increases with the increase of diamond density, and the density is about 97.5% when the volume fraction of diamond reaches 70% Its thermal conductivity rises, the highest thermal conductivity is 404W / mK.