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在1143～1213K、120～1500s参数范围内以Ag-Cu-Ti箔为钎料对TiAl合金与42CrMo钢进行了真空钎焊试验。采用光学显微镜、扫描电镜、元素面扫描和能谱分析等方法对界面组织进行了分析,测量了界面反应层厚度。分析了界面反应层的形成过程及受控因素,计算了反应层成长的动力学参数。结果表明,接头界面反应层包括靠近TiAl合金的AlCuTi+Ti3Al层、AlCu2Ti层以及靠近42CrMo钢的TiC层,其成长活化能分别为324.97、207.97、338.03kJ/mol。TiAl合金与钎料的界面反应层受控于液态钎料中的Cu元素,成长较快;42CrMo钢与钎料间的TiC层受控于固态钢中C元素,成长较慢。脆性反应层AlCuTi+Ti3Al层厚度为3.3μm时接头强度最高,脆性层厚度继续增大,接头强度显著下降。
In the range of 1143 ~ 1213K and 120 ~ 1500s, the brazing experiments of TiAl alloy and 42CrMo steel with Ag-Cu-Ti foil as brazing material were carried out. The interface microstructure was analyzed by optical microscopy, scanning electron microscopy, elemental surface scanning and energy spectrum analysis. The interface reaction layer thickness was measured. The formation process and controlled factors of interface reaction layer were analyzed, and the kinetic parameters of reaction layer growth were calculated. The results show that the interface reaction layer consists of AlCuTi + Ti3Al layer, AlCu2Ti layer and TiC layer close to 42CrMo steel near the TiAl alloy. The activation energies are 324.97, 207.97 and 338.03 kJ / mol, respectively. TiAl alloy and solder interfacial reaction layer controlled by the liquid solder in the Cu element, grow faster; 42CrMo steel and brazing TiC layer controlled by the solid-state steel C element, slow growth. When the thickness of brittle reaction layer AlCuTi + Ti3Al layer is 3.3μm, the joint strength is the highest, the thickness of brittle layer continues to increase, and the joint strength decreases significantly.