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东丽道康宁面向SiC等新一代功率半导体,开发出了兼顾耐热性及加工性的新型硅类封装材料。特点是可在250℃条件下连续使用,而且加工性较高。比
Dow Corning faces a new generation of power semiconductors such as SiC and has developed a new silicon-based packaging material that combines heat resistance and processability. Features can be used continuously at 250 ℃, and higher workability. ratio