论文部分内容阅读
泰科电子推出一项突破性技术,可使制造商们将表面贴装的热保护器件纳入到他们符合RoHS规范的标准回流焊组装工艺中。制造商们将因由手工装配过渡到具有高性价比的表面贴装器件(SMD)工艺而节省了大量费用。此款可回流焊热保护器件采用业界标准的元件贴装和无铅回流焊设备,可使该
Tyco Electronics introduces a breakthrough technology that enables manufacturers to incorporate surface-mount thermal protection devices into their standard RoHS compliant reflow soldering assembly process. Manufacturers will save significant costs by making the transition from hand-assembled to cost-effective surface mount device (SMD) processes. This reflow soldering heat protection device uses industry-standard component placement and lead-free reflow soldering equipment that allows