论文部分内容阅读
In this paper, a new type of through-silicon via(TSV) for via-first process namely bare TSV, is proposed and analyzed with the aim of mitigating noise coupling problems in 3D integrated systems for advanced technology nodes. The bare TSVs have no insulation layers, and are divided into two types: bare signal TSVs and bare ground TSVs. First, by solving Poisson’s equation for cylindrical P–N junctions, the bare signal TSVs are shown to be equivalent to conventional signal TSVs according to the simulation results. Then the bare ground TSV is proved to have improved noise-absorption capability when compared with a conventional ground TSV. Also, the proposed bare TSVs offer more advantages to circuits than other noise isolation methods, because the original circuit design,routing and placement can be retained after the application of the bare TSVs.
In this paper, a new type of through-silicon via (TSV) for via-first technology is bare TSV, is proposed and analyzed with the aim of mitigating noise coupling problems in 3D integrated systems for advanced technology nodes. The bare TSVs have no First, by solving Poisson’s equation for cylindrical P-N junctions, the bare signal TSVs are shown to be equivalent to conventional signals TSVs according to the simulation results. Then the bare ground TSV is proved to have improved noise-absorption capability when compared with an conventional ground TSV. Because the bare bare TSVs offer more advantages to circuits than other noise isolation methods, because the original circuit design, routing and placement can be retained after the application of the bare TSVs.