22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

来源 :Journal of Semiconductors | 被引量 : 0次 | 上传用户:wing870202
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In this work,the performance of L_g = 22 nm In_(0.75)Ga_(0.25)As channel-based high electron mobility transistor(HEMT) on InP substrate is compared with metamorphic high electron mobility transistor(MHEMT) on GaAs substrate.The devices features heavily doped In_(0.6)Ga_(0.4)As source/drain(S/D) regions,Si double δ-doping planar sheets on either side of the In_(0.75)Ga_(0.25) As channel layer to enhance the transconductance,and buried Pt metal gate technology for reducing short channel effects.The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T,f_(max) and transconductance(g_(m_max)).The 22 nm InP HEMT shows an f_T of 733 GHz and an f_(max) of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz,respectively.InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications. In this work, the performance of L_g = 22 nm In_ (0.75) Ga_ (0.25) As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate.The devices features heavily doped In_ (0.6) Ga_ (0.4) As source / drain (S / D) regions, Si double δ-doping planar sheets on either side of the In_ (0.75) Ga_ (0.25) As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_ (max) and transconductance (g_ (m_max)). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_ (max) of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP / GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.
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