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本文研究的内容是用高频双向脉冲电镀电源来代替传统的直流电镀电源,以实现更好的电镀效果,满足多层、高密度印刷电路板镀铜的需要。文章对脉冲电镀电源的原理进行了深入的介绍,阐述了双向脉冲电镀电源在实际电镀中的优势,说明工业生产中采用双向高频脉冲电镀电源的优势和必要性。同时,文章对DC/DC变换的原理做了一个简要的概述,介绍了DC/DC变换的基本分类、构成以及相关电路。
The content of this paper is to use high-frequency bi-directional pulse plating power instead of the traditional DC power supply in order to achieve better electroplating effect and meet the needs of multi-layer, high-density PCB copper plating. The article introduces the principle of pulse electroplating power supply in detail, expounds the advantages of bi-directional pulse electroplating power supply in actual electroplating, and shows the advantages and necessity of using bi-directional high frequency pulse electroplating power supply in industrial production. At the same time, the article gives a brief overview of the principle of DC / DC conversion, introduces the basic classification of DC / DC converter, the structure and related circuits.