论文部分内容阅读
管壳和封装工艺的选择,直接影响到电路的热阻.合理的设计和封装工艺将会显著降低电路热阻,降低芯片结温,从而提高电路寿命.特别在今天,中大规模电路日益增多,电路密度增加,功耗日益增大.对散热方面的研究更有迫切的要求,对热阻研究工作的深入开展更有其重要意义.管壳热阻数值不但是电路设计者所需的重要参数,同时也是研究老化筛选方法的重要依据.而国内对这方面工作的重要性认识不足,进行的工作较少.其中部分工作由于测试方法中存在严重缺点而影响结果的精确性.一
The choice of case and package process has a direct impact on the thermal resistance of the circuit. A reasonable design and packaging process will significantly reduce the thermal resistance of the circuit, reduce the chip junction temperature, thereby increasing the circuit life. , The circuit density increases, the power consumption increases day by day.It is more urgent that the research on the heat is more urgent, and it is more important to carry on the research work of the heat resistance deeply.Historical heat-resistance numerical value is not only important to the circuit designer Parameters, but also an important basis for the study of aging screening methods.While domestic understanding of the importance of this work is not enough, less work.Among them some of the work because of the serious shortcomings in the test method to affect the accuracy of the results.