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由中国电子学会生产技术学分会电子封装专委会(CIE-CEPS)主办,并由国际电子与电气工程师协会元件制造与封装分会、国际微电子与封装协会、新加坡微电子研究所、日本电子封装学会、飞利浦半导体、乔治利亚利科技大学、马里兰大学、IEEE-CPMT北京分会、中国电子科学研究院、哈尔滨工业大学、清华大学、复旦大学、上海交通大学、华中科技大学、河北半导体研究所、无锡微电子研究中心、深圳市人民政府、中国国际文化交流中心等18家单位共同发起的
Organized by CIE-CEPS, the Institute of Technology and Technology of the Chinese Institute of Electronics, and co-organized by the International Association of Electronics and Electrical Engineers Component Manufacturing and Packaging Branch, the International Microelectronics and Packaging Association, the Institute of Microelectronics of Singapore, Institute of Electronics, Philips Semiconductors, Georgetown University of Livery, University of Maryland, IEEE-CPMT Beijing Branch, China Electronics Research Institute, Harbin Institute of Technology, Tsinghua University, Fudan University, Shanghai Jiao Tong University, Huazhong University of Science and Technology, Wuxi Microelectronics Research Center, Shenzhen Municipal People’s Government, China International Cultural Exchange Center and other 18 units co-sponsored