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介绍了硅－玻璃静电键合的基本原理，阐述了在自建静电键合设备上实现静电键合的过程。结合其在微机械传感器中的应用，讨论了粗糙表面的键合技术。
The basic principle of silicon-glass electrostatic bonding is introduced, and the process of electrostatic bonding on the self-built electrostatic bonding device is described. Combined with its application in micro-mechanical sensors, the bonding technology of rough surface is discussed.