第四届固体和集成电路技术国际会议在京召开

• 作 者: 辰申
• 出 处: 微电子技术
• 发表日期: 1995年06期
• 关键词: 集成电路技术 日至 金属化 谢希德 化合物半导体 非晶硅 物理分析 光电器件 相关技术

第四届固体和集成电路技术国际会议于1995年10月24日至28日在北京召开。大会共录用论文215篇，来自美国、日本、朝鲜、南韩、德国、新加坡、中国等近二十个国家和地区的代表200余人参加会议。我国著名学者谢希德教授作了题为“中国yLSI的发展，过去、现在和将来”的大会报告。I

The Fourth International Conference on Solid State Technology and Integrated Circuit Technology was held in Beijing from October 24 to October 28, 1995. A total of 215 papers were accepted by the conference. More than 200 representatives from nearly 20 countries and regions including the United States, Japan, North Korea, South Korea, Germany, Singapore and China attended the conference. Professor Xie Xide, a famous scholar in our country, gave a conference report entitled “Development, Past, Present and Future of China yLSI”. I