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一、引言真空蒸镀薄膜的质量主要取决于三个工艺因素:1.基板温度;2.蒸镀速率;3.剩余气体。对于蒸镀速率和剩余气体的压强与成分的测定,已有很好的方法和现成的仪器设备。但是,对于基板温度的测定却相当困难。采用温度计或热电偶等测温元件测定基板温度,不仅在真空室中会引入污染源,而且由于受热情况不同,测量元件的温度与待测基板的温度并不相同,因而测量结果是不可靠的。然而,基板温度对于薄膜基本性质的影响却十分明显,为了深入研究薄膜,正确可靠地测定镀膜过程中的基板温度是非常必要的。
I. INTRODUCTION The quality of vacuum deposited films mainly depends on three process factors: 1. substrate temperature; 2. evaporation rate; 3. residual gas. There are well-established methods and off-the-shelf instrumentation for the determination of the vapor deposition rate and the pressure and composition of the remaining gases. However, it is quite difficult to measure the substrate temperature. The use of thermometers or thermocouples to measure substrate temperature not only introduces a source of contamination in the vacuum chamber, but also the temperature of the measurement element is not the same as the temperature of the substrate to be tested due to the different heating conditions, so the measurement result is not reliable. However, the influence of the substrate temperature on the basic properties of the film is very obvious. In order to further study the film, it is necessary to accurately and reliably measure the substrate temperature during the coating process.