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为实现电子产品的高可靠和小型化,目前仍普遍使用的有引线元器件及其插入式安装方法,已逐渐被片状式元器件(SMC、SMD)和与之适应的表面安装技术(sMT)所代替。在我国SMT装配日益发展,现正经历着由八十年代初期的技术材料设备引进,发展到逐步实现其国产化和不断创新阶段。为了更好地促进国内SMT的技术进步,现将我厂在CCD摄像机生产中SMT应用情况作如下介绍,以供参考。 1 SMT的装配程序我厂生产的CCD5670型摄像机较多地使用了0805封装规格尺寸2×1.25,1206封装规格,尺寸3.2×1.6的LCR(电感—电容—电阻)片状元件
In order to achieve high reliability and miniaturization of electronic products, lead components and plug-in mounting methods, which are still commonly used today, have been gradually adopted by chip-type components (SMC, SMD) and their compatible surface mount technologies (sMT ) Instead. In our country, the SMT assembly is developing day by day. Now it is undergoing the process of introducing and developing the technical materials and equipment from the early 1980s to gradually realizing its localization and continuous innovation. In order to better promote the technological progress of the domestic SMT, now I plant in the CCD camera production in the application of SMT as follows for reference. 1 SMT assembly process I produced the CCD5670 camera to use more 0805 package size specifications 2 × 1.25,1206 package size, size 3.2 × 1.6 LCR (inductor - capacitor - resistor) chip components