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最近几年,电子部件增加了采用由导电聚酯厚膜(PTFS)制成的印制电路,这种方法比起其它的制(布)线来,特别是采用化学蚀刻电镀等方法有更好的成本—效益和有效性。遣憾的是,常规的 PTFS 仍遇到某些局限性,如差的可焊性、导电率和附着力,从而在多方面限制了应用。因此,一种新的导电材料,即金属充填聚酯的组成物已开发出来,它克服了这些问题。这种新材料是以态液相烧结(TLPS=transient Liquid-phase Sin-tering)为基础的,其中,组成的金属成分是以相当低的温度来烧结的,并形成高导电性而连续的金属网络(Network)。最后的产品是高导电性、可焊的和在大范围的基材中具有优良的附着力。采用这种油墨与常规的光成像技术相结合而制成高密度、多层板和电子组装等的新工艺已进行了研究,早期已表明了这种具有精细电路的电子封装。本文主要叙述作为特性阻抗控制用的电镀层和地层问题以及采用微带线(microstrip)和带状线(stripline)设计来获得噪音的降低。随着材料深入研究,进一步提出网板等级的有效 EMI 屏蔽,使这个方法获得附加的好处。新奇的工艺比常规减成法技术,简化了印制电路制造、降低了粗糙度(profile),在制造中避免了大多数的废水,降低了成本,而且没有一般 PTFs 的常规性能之损失。
In recent years, there has been an increase in the use of printed circuits made of electrically conductive polyester thick film (PTFS) for electronic components, which is much better than other fabrication lines, especially by chemical etching The cost - effectiveness and effectiveness. Regrettably, conventional PTFS still encounters certain limitations, such as poor solderability, conductivity and adhesion, limiting applications in many ways. Therefore, a new conductive material, that is, a metal-filled polyester composition, has been developed which overcomes these problems. The new material is based on TLPS (transient liquid-phase Sintering) in which the constituent metal components are sintered at relatively low temperatures and form a highly conductive and continuous metal Network. The final product is highly conductive, solderable and has excellent adhesion in a wide range of substrates. New processes using such inks in combination with conventional photo-imaging technologies to make high-density, multi-layer boards, and electronic assemblies have been studied and such electronic packages with fine circuits have been shown earlier. This article focuses on plating and formation issues as a characteristic impedance control and on noise reduction using microstrip and stripline designs. As materials are further explored, further screen-level effective EMI shielding is presented, giving this approach additional benefits. The novelty of the process simplifies the manufacturing of printed circuits, reduces the profile, eliminates most of the wastewater in manufacturing, reduces costs, and reduces the general performance of conventional PTFs, compared to conventional subtractive techniques.