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使有源元件在硬的或软的基底上进行互连的印制电路技术已得到了广泛的应用。在大多数情况下使用铜导体图象。现在,形成导体图象有两种基本的方法: (1)减去法(腐蚀法),和 (2)添加法。虽然减去法还在广泛地使用,添加法由于能节约费用和减少污染已开始广泛地采用。用添加法制造印制电路有两种不同的方法。 (1)半添加法(图1),和 (2)全添加法(图2)。在这两种方法中,都使用不覆箔绝缘基体作为加工工序的出发点,都进行表面处理以提高金属膜和基底之间的附着力。此外,在二种情况下都进行表面催化处理,为化学沉铜过程提供催化性表面。为了形成催化性表面(核化表面),广泛地使用两
Printed circuit technologies that interconnect active devices on hard or soft substrates have found widespread use. In most cases use copper conductor images. Now, there are two basic ways of forming a conductor image: (1) subtraction (etching), and (2) addition. Although the subtraction method is still widely used, the addition method has started to be widely adopted due to cost savings and pollution reduction. There are two different ways to make a printed circuit using additive methods. (1) semi-additive method (Figure 1), and (2) full addition method (Figure 2). In both of these methods, the non-foil-coated insulating substrate is used as a starting point for the processing, and the surface treatment is performed to improve the adhesion between the metal film and the substrate. In addition, surface catalysis was performed in both cases to provide a catalytic surface for electroless copper deposition. To form a catalytic surface (nucleation surface), two widely used