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随着晶片封装技术的不断发展,要求基板线路的精细度越来越高,50μm/50μm以下的COF(Chip on Flex)精细线路将成为未来发展的主流,但精细线路的制作一直是FPC生产上的难点,当线路在50μm/50μm以下时,成品率较低难以满足量产化的要求。本文中以公司的现有设备为基础,通过传统片式生产线,选用12μm铜箔作为基材、15μm干膜作为抗蚀层,使用玻璃菲林进行图形转移,同时通过表面处理、改变曝光、显影和蚀刻参数等,对30μm/25μm的精细线路进行研制,并通过金相切片测试仪、三次元测试仪、AOI(Automatic Optical Inspector)等对产品进行检查。结果显示,线宽、蚀刻系数和成品率都能达到小批量生产的要求。
With the continuous development of the chip packaging technology, the finer circuit of the substrate circuit is required, and the fine line of COF (Chip on Flex) under 50μm / 50μm will become the mainstream of the future development. However, the manufacture of the fine circuit has been the production of FPC The difficulty, when the line is below 50μm / 50μm, the yield is low and it is difficult to meet the requirements of mass production. In this paper, the company’s existing equipment as the basis, through the traditional chip production line, the choice of 12μm copper foil as a substrate, 15μm dry film as a resist, the use of glass film for graphic transfer, at the same time by surface treatment, change the exposure, development and Etching parameters, the fine lines of 30μm / 25μm for development, and through the metallographic section tester, three yuan tester, AOI (Automatic Optical Inspector) and other products to be checked. The results show that the line width, etching factor and yield can meet the requirements of small batch production.