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建立了微尺度BGA焊点拉伸有限元分析模型,研究了拉伸加载条件下焊点高度、直径和焊盘直径对焊点拉伸应力应变的影响。结果表明:拉伸条件下,微尺度BGA焊点顶端和底端的应力应变要大于焊点中间部分,焊点顶部和底部位置为高应力应变区域;在只单一改变焊点高度、直径和焊盘直径其中之一的前提下,随着焊点高度、直径和焊盘直径的增加,微尺度BGA焊点内的最大应力应变均相应减小;在置信度为90%的情况下,焊点直径对拉伸应力影响最大,其次是焊盘直径,最后是焊点高度;焊点直径对焊点拉伸应力具有显著影响,焊盘直径和焊点高度对焊点拉伸应力影响不显著。
The tensile finite element model of micro-scale BGA solder joint was established. The influence of the solder joint height, diameter and pad diameter on the tensile stress-strain of the solder joint under tensile load was studied. The results show that the stress and strain at the top and bottom of micro-scale BGA solder joints are greater than those in the middle of the solder joints and the top and bottom solder joints are in high stress and strain regions under tensile conditions. Diameter, and the diameter of the pad increases, the maximum stress and strain in the microscale BGA solder joint decreases correspondingly. In the case of a 90% confidence level, the solder joint diameter The largest impact on the tensile stress, followed by the pad diameter, and finally the height of the solder joints; solder joint diameter has a significant impact on the tensile stress of the solder joints, pad diameter and solder joint height on the tensile stress of the solder joint is not significant.