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利用电弧离子镀方法在201不锈钢基体上制备了Ti N薄膜,研究了脉冲偏压占空比和基体放置状态对大颗粒形貌和分布规律的影响。采用扫描电镜观察了Ti N薄膜的表面形貌,利用Image J图像软件对Ti大颗粒的数目和尺寸进行了分析。结果表明:在工艺参数相同情况下,转动时Ti N薄膜表面的大颗粒数目较多;随脉冲偏压占空比的增大,薄膜表面的大颗粒数目迅速降低,当占空比为40%时,大颗粒所占的面积比达到最小值,分别为静止时的1.9%和转动时的6.8%,为最佳的占空比值。
TiN thin films were prepared on 201 stainless steel substrates by arc ion plating. The effects of pulse bias duty cycle and substrate placement on the morphology and distribution of large particles were investigated. The surface morphology of TiN thin films was observed by scanning electron microscopy. The number and size of large Ti particles were analyzed by Image J image software. The results show that when the process parameters are the same, the number of large particles on the surface of TiN film is larger when the rotation speed is higher. With the increase of the pulse bias duty cycle, the number of large particles on the surface of the film decreases rapidly. When the duty cycle is 40% , The area ratio of large particles reached the minimum, which was 1.9% at rest and 6.8% at turning, respectively, which was the best duty cycle value.