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1985年IEEE超声年会于10月16—18日在美国旧金山市举行,会议分成40个专题技术小组进行分组讨论,其中有15个小组专门讨沦SAW技术。这次会议共收到论文254篇,其中论述声表面波(SAW)和有关微波技术的论文约60篇,其内容包括SAW、声体波振荡器和谐振器、频率提高到千兆赫级的体波器件,以及新的SAW材料。10篇特约报告论述了SAW技术应用的发展前景并与其他高级技术,特别是与光信号处理技术的对比。 为数较多的专题论文论述了SAW谐振器、振荡揣和滤波揣及它们在近几年内的进展。休利特-帕卡德公司微波技术部的研究人员,论述了改用薄膜结构通过热处理降低SAW谐振器SSB相位噪声和提高工作频率有关的实验结果。该技术部的其
The 1985 IEEE Ultrasound Annual Meeting was held in San Francisco, USA on October 16-18, and was divided into 40 thematic technical groups for group discussion, of which 15 were dedicated to SAW technology. A total of 254 papers were received at the conference, covering about 60 SAW papers and about 60 papers on microwave techniques, including SAW, acoustic wave oscillators and resonators, frequency up to gigahertz Wave devices, and new SAW materials. Ten special reports discuss the future of SAW technology and compare it with other advanced technologies, especially with optical signal processing. A large number of monographs deal with SAW resonators, oscillation hysteresis, and filtering and their progress in recent years. Researchers at Hewlett-Packard’s Microwave Division discuss the experimental results of using thin-film structures to reduce the SSB phase noise and increase the operating frequency of SAW resonators by heat treatment. The Ministry of Technology