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2012年中国集成电路产业各环节均实现了快速增长。产业结构上,IC设计业与芯片制造业所占比重呈逐年上升的趋势。总体而言,IC设计业显示出较强的增长态势,增速位列第一,半导体十大制造企业均迈上10亿元台阶,而封装测试企业仍以外企为主。CSIA认为中国半导体业面临四大挑战:挑战一:技术发展-全球半导体技术创新难度加大,研发及产业化负担加重;挑战二:市场形势-坐拥全球最大市场,但严重依赖进口的局面未有改善;挑战三:规模效益-国内芯片代工需求持续扩大,但面临着技术与投资两大瓶颈,在全球代工业中所占比例下降;挑战四:产业链整合-商业模式创新给国内企业发展带来机遇,但国内企业小且分散,同质化严重,整
In 2012, all aspects of China’s IC industry have achieved rapid growth. On the industrial structure, the proportion of IC design industry and chip manufacturing industry has been increasing year by year. Overall, IC design industry showed a strong growth momentum, the growth rate ranked first, the semiconductor top ten manufacturing companies have all reached 1 billion yuan level, while the packaging and testing enterprises are still mainly foreign-owned enterprises. CSIA believes that China’s semiconductor industry is facing four major challenges: Challenge 1: Technology Development - Global semiconductor technology innovation more difficult, R & D and industrialization burden; Challenge 2: Market situation - sitting in the world’s largest market, but relies heavily on imports situation Challenges 3: economies of scale - the domestic chip OEM demand continues to expand, but faces two major bottlenecks in technology and investment, the proportion of the global foundry industry decline; Challenge 4: the integration of the industrial chain - business model innovation to domestic enterprises The development brings opportunities, but the domestic enterprises are small and scattered with serious homogeneity