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DISCO为全球最大半导体划片,磨片,抛光加工设备供应商。迪思科科技(中国)有限公司为其在华的全资子公司。本公司现有专业的现场服务工程师、工艺开发工程师超过80名、并在上海、苏州、北京、天津、成都、深圳、大连、西安、惠州、厦门及武汉设有分公司或办事处,实现了中国大陆半导体产业发达地区的全面覆盖。本公司在上海总部配备有DGP8761、DFD6362、DFD6340、DFL6560、DAD3650、,DAD3350、DAD322、DFG8540、DFL7020等供工艺开发和人员培训的设备。
DISCO is the world’s largest semiconductor dicing, grinding, polishing equipment suppliers. Di Cisco Technology (China) Co., Ltd. for its wholly-owned subsidiary in China. The company’s existing professional field service engineers, process development engineers more than 80, and in Shanghai, Suzhou, Beijing, Tianjin, Chengdu, Shenzhen, Dalian, Xi’an, Huizhou, Xiamen and Wuhan branch offices to achieve Full coverage of China’s semiconductor industry in developed areas. The company in Shanghai headquarters equipped with DGP8761, DFD6362, DFD6340, DFL6560, DAD3650, DAD3350, DAD322, DFG8540, DFL7020 for process development and personnel training equipment.