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MEMS封装系统应有MEMS执行感应功能,而且还要避免受到外界环境的影响,同时持续地改进质量,达到较高的ppm性能。本文采用SOIC封装,必须维持一个特定的共振频率,从而防止传感器被粘住或卡住。同时,封装必须确保传感器是可靠和完整的,没有出现断裂或输出偏差。本文采用一种综合学科研究方法,以确定合适的固晶材料来彻底解决器件断裂的问题。这种方法涉及振动分析、电气响应测定、压力分析和断裂力学。
The MEMS packaging system should have MEMS-implemented sensing capabilities, yet be immune to the external environment while continuously improving quality and achieving higher ppm performance. This article uses SOIC package, you must maintain a specific resonant frequency, thereby preventing the sensor is stuck or stuck. At the same time, the package must ensure that the sensor is reliable and complete without breakage or output deviation. In this paper, a comprehensive research approach to determine the appropriate solid crystal materials to completely solve the problem of device fracture. This method involves vibration analysis, electrical response measurement, pressure analysis and fracture mechanics.