论文部分内容阅读
目前,关于温度对建筑物结构应力影响的确切过程尚在研究摸索中,在许多温度模型试验中,仍停留在稳定温度场阶段。但是,在砼坝施工过程中温升引起建筑物的裂缝严重,甚至有的水工建筑物因温升引起的裂缝已危及建筑物的安全。在设计与模型试验中,仅采用稳定温度场修正砼施工中温度影响,其结果不够满意。要解决这个问题,应在三维模型试验中采用变温场,为设计提供定量的温度应力值。我们为水利部门温度光弹模型试验研究了光电跟踪半导体致冷温度控制仪,该仪器可适用于有关变温场的其他领域,如航空、机械、暖通等方面。封三下图是该仪器外形图。
At present, the exact process of the effect of temperature on the structural stress of buildings is still being explored, and in many temperature model tests, it remains at a stable temperature field. However, during the concrete dam construction, the temperature rise caused serious cracks in the building, and even cracks caused by temperature rise of hydraulic structures have endangered the safety of buildings. In the design and model tests, only the temperature field is used to correct the influence of temperature in concrete construction, and the result is unsatisfactory. To solve this problem, a variable temperature field should be used in the 3D model test to provide a quantitative temperature stress value for the design. We have researched the Photo-tracking semiconductor cooling temperature controller for the temperature photo-elastic model test of water conservancy department. The instrument can be applied to other fields related to temperature field, such as aviation, machinery, HVAC and so on. Seal the following figure is the outline of the instrument.