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在一个比传统分立器件小的多的封装里，集成了7O多个无源器件。这就是（二Mier（。Devices（CMD）公司9月在99’．上海第＿二届无线电技术研讨会暨展览会上所展示的，运用薄底片无源器件集成与晶片级封装两种技术后所生产七b）‘”品。CJlhr…aMicroDe…ces成从十198O年，在美
In a much smaller package than traditional discrete devices, more than 70 passive components are integrated. This is what Mier (.Devices (CMD)) demonstrated at Sept. 2 in Shanghai at the 2nd Wireless Technology Symposium and Exhibition in September. After the technology of thin film passive components integration and wafer level packaging Produced by the seven b) ’’ products. CJlhr ... aMicroDe ... ces into the decade from 198O, in the United States