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在集成电路圆片的生产制造过程中,产品线通常会采取一些方法来监控生产过程以确保产品的合格率,对这个过程的控制监控简称PCM。监控PCM的参数能及时发现问题,如果对发现的问题及时改进,那么对于提高产品成品率和可靠性是一种比较有效的手段。产品的成品率在理想的情况下决定了一种工艺的缺陷密度,工艺波动造成的某些PCM参数的离散往往是影响成品率的主要因素。所以产品的可靠性和PCM参数的设置,以及PCM参数漂移有着极为密切的关系。
In the production of integrated circuit wafer manufacturing process, the product line usually take some methods to monitor the production process to ensure the passing rate of the product, the control of the process referred to as PCM. Monitoring PCM parameters can be found in time, if the problems found in time to improve, then for improving product yield and reliability is a more effective means. The yield of the product determines the defect density of a process under ideal conditions. The dispersion of some PCM parameters caused by the process fluctuation is often the main factor affecting the yield. Therefore, the reliability of the product and the setting of PCM parameters, as well as PCM parameter drift has a very close relationship.