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众所周知,半导体集成电路制造过程中的初测(即以前所称的“中间测试”),芯片是通过探针与测试系统连接传递信号。测试质量取决测试点(电极)的接触状态。而此点在很大程度上是由探针的内在质量来保证的。探针卡片的内在质量主要包括:探针材料的机械性能及电气性能;探针的结构尺寸;针尖共面度;针间电容;线迹电容;线迹电阻;针尖接触电阻等内容。如何正确选择这些参数,以保证探卡具有优良可靠的使用性能,是设计制作探卡时必须首先考虑的问题。本文拟就探卡参数对测试的影响及选取原则,使用中的维护以及探卡的最新发展三个方面作一些探讨和介绍。
As we all know, the first test (ie, the so-called “intermediate test”) in the manufacture of semiconductor integrated circuits, the chip is connected to the test system through the probe signal transmission. The quality of the test depends on the contact state of the test point (electrode). This point is to a large extent guaranteed by the intrinsic quality of the probe. The inherent quality of the probe card includes: mechanical properties and electrical properties of the probe material; probe structure size; needle coplanarity; needle capacitance; stitch capacitance; stitch resistance; tip contact resistance and so on. How to correctly select these parameters to ensure the card has excellent and reliable performance, is designed to make cards must first consider the issue. This paper intends to probe the parameters of the test on the impact and selection principles, the use of maintenance and exploration of the latest developments in the card for some discussion and introduction.