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运用电气压接技术的先进功率模块设计简化了装配过程。这项技术可应用于功率端子、辅助门极、发射极和传感器触点。多年来一些产品系列一直使用的是低温锡铅印刷电路板,如 SKiiP 或 MiniSKiiP。然而法规和市场需求推动的无铅运动迫使我们新开发了适应新一代无铅驱动电路的连接技术。无铅压接系统的发展目前印刷电路板生产是将一层薄的锡铅焊料层涂覆在铜皮及焊盘表面,为元件安装面的焊接提供了合适的界面。热风整平技术(HAL)提供了满足表面平整度要求的镀层。HAL 技术也能应用于压接型电接触,该电接触使用的弹簧引脚镀了一层特殊的锡合金以增强触点导电性。即将到来的向无铅 PCB 生产转变的趋势,要求现有技术必须革新。目前正在研究通过化学沉淀锡层或锡银
Advanced power module design using electrical crimp technology simplifies the assembly process. This technology can be applied to power terminals, auxiliary gate, emitter and sensor contacts. Some product lines have been using low-temperature tin-lead printed circuit boards over the years, such as SKiiP or MiniSKiiP. However, the lead-free movement driven by regulations and market demand forced us to develop a new connection technology adapted to a new generation of lead-free driver circuits. The development of lead-free crimping system At present, the production of printed circuit board is a thin layer of tin-lead solder coating on the surface of the copper and pad, the component mounting surface of the welding provides a suitable interface. Hot air leveling (HAL) provides a coating that meets the requirements of surface flatness. HAL technology can also be applied to the crimp-type electrical contacts, the electrical contact using the spring pin plated with a special tin alloy to enhance the contact conductivity. The upcoming trend towards lead-free PCB production requires the prior art to be revolutionized. Research is currently under way to chemically precipitate tin or tin silver