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采用电子背散射衍射(EBSD)技术研究了不同变形量冷轧的工业纯铜样品经650℃/5 min高温退火后的晶界特征分布(GBCD)。结果表明:经小变形(10%)轧制并退火的样品中出现了较多的∑3,∑9和∑27特殊晶界,特殊晶界的比例达到76%,有效地阻断了一般大角度晶界的网络连通性,样品的GBCD得到优化。随着轧制变形量的不断增加(20%-40%),样品经高温退火后,特殊晶界的比例逐渐下降,不能有效地阻断一般大角度晶界的网络连通性,样品的GBCD没有得到优化。进一步分析认为:和中等变形量(30%-40%)相比,小变形量的样品形变储存能较少,不足以在后续的退火过程中发生以生成一般大角度晶界为特征的再结晶行为,而是以应力诱发晶界迁移(SIBM)为主,这可能是GBCD得到优化的关键。
The electronic backscatter diffraction (EBSD) technique was used to study the grain boundary characteristic distribution (GBCD) of cold-rolled industrial pure copper samples with different deformations annealed at 650 ℃ for 5 min. The results show that there are more special Σ3, Σ9 and Σ27 grain boundaries in the sample annealed by small deformation (10%) and the proportion of special grain boundaries reaches 76%, effectively blocking the large Angle of the grain boundary network connectivity, sample GBCD is optimized. With the increase of rolling deformation (20% -40%), the proportion of special grain boundaries gradually decreases after high temperature annealing, which can not effectively block the network connectivity of the general high angle grain boundaries. The sample GBCD has no Get optimized. Further analysis shows that the sample with small deformation has less deformation deformation than the medium deformation (30% -40%), which is not enough for the recrystallization characterized by the formation of the general large-angle grain boundaries in the subsequent annealing process Behavior, but stress-induced grain boundary migration (SIBM) dominated, which may be the key to GBCD optimization.