Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump sh

• 作 者: Ping Chen Xiu-Chen Zhao Ying Liu Hong Li Yong Wang
• 机 构: School of Materials Science and Engineering,Beijing Institute of Technology,Beijing 100081,China;Cen
• 出 处: 稀有金属（英文版）
• 发表日期: 2021年1期
• 关键词: Bump shape Lead-free solder Intermetallic compounds Mechanical properties

The effects of bump shape on the aging resis-tance and mechanical properties of Sn3.0Ag0.5Cu(SAC)solder bump joints were investigated by high-temperature aging test and shear test.Three different SAC solder bump joints with barrel type,cylinder type,and hourglass type,respectively,were provided by controlling solder process.The results indicate that as the bump volume decreases from barrel bump to hourglass bump in the reflow,the thickness growth rate of intermetallic compounds(IMCs)between different solder joints and Cu substrates in the isothermal aging of 150℃decreases.And the change of shear strength of hourglass interconnection solder joint with the increase in temperature is the minimum in the three interconnection solder joints.Thus,as the solder dosage decreases properly,hourglass interconnection sol-der joint is obtained,which is avail to enhance the solder joint reliability at the high-temperature aging and the ability to adapt to the change of environment temperature suddenly.