论文部分内容阅读
基于Cu和Sn元素在焊接界面扩散结构(Cu/Cu3Sn/Cu6Sn5/Sn)中的扩散通量比理论模型,将SnX5.0Cu1.5Ni焊点在180℃进行等温时效,研究SnX5.0Cu1.5Ni焊点中金属间化合物(Intermetallic Compound,IMC)的Cu3Sn与Cu6Sn5两相组织形貌演变和生长行为。结果表明:SnX5.0Cu1.5Ni界面金属间化合物的Cu3Sn与Cu6Sn5两相增厚主要由扩散机制控制,Cu3Sn相生长速率为4.16×10-18m2/s,Cu6Sn5生长速率为1.06×10-17m2/s。在时效初期,IMC的形态呈扇贝形状,此时Cu3Sn快速生长,并消耗Cu6Sn5层,因此Cu6Sn5在时效初始阶段厚度降低,Cu3Sn厚度升高;随着时效时间的延长,IMC的形态向着平层形状转变,Cu3Sn的生长速率降低,对Cu6Sn5层的消耗也逐步减少;随着时效时间的进一步延长,Cu3Sn和Cu6Sn5的厚度继续增大,使得金属化合物在应力过大而破裂。
Based on the theoretical model of diffusion flux ratio of Cu and Sn elements in the diffusion interface of Cu / Cu3Sn / Cu6Sn5 / Sn, the SnX5.0Cu1.5Ni solder joints were isothermally aged at 180 ℃, and the SnX5.0Cu1.5Ni solder The morphologies and growth behavior of Cu3Sn and Cu6Sn5 phases in intermetallic compounds (IMCs) were investigated. The results show that the two-phase thickening of Cu3Sn and Cu6Sn5 in intermetallic SnX5.0Cu1.5Ni interface is mainly controlled by the diffusion mechanism, the growth rate of Cu3Sn phase is 4.16 × 10-18m2 / s, the growth rate of Cu6Sn5 is 1.06 × 10-17m2 / s . At the initial stage of aging, the shape of IMC was scallop, and Cu3Sn grew rapidly and consumed Cu6Sn5 layer. Therefore, the thickness of Cu6Sn5 decreased at the initial stage of aging and the thickness of Cu3Sn increased. With the extension of aging time, The growth rate of Cu3Sn decreases and the consumption of Cu6Sn5 layer decreases gradually. With the further extension of aging time, the thicknesses of Cu3Sn and Cu6Sn5 continue to increase, which makes the metal compounds ruptured under the stress.