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金以其电阻率低、耐腐蚀、不生成表面氧化物和硫化物等特点,理所当然地选用作低压电路的接触材料。然而,金价上涨,促进了廉价接插件涂复的研究。国际锡研究会(ITRI),用电镀或热浸镀Sn、60Sn/40Pb、Sn/35Ni等涂层,测定其接触电阻。当接触压力≥100克时,锡镀层有低的接触电阻,且有良好的重现性,最终性能可与金媲美。但接触压力<30克时,其表面上的氧化膜不
Gold with its low resistivity, corrosion resistance, does not generate surface oxides and sulfides and other characteristics, of course, selected for low-voltage circuit contact materials. However, the rising price of gold has promoted the research of inexpensive connector coating. International Tin Research Council (ITRI), with electroplating or hot-dip Sn, 60Sn / 40Pb, Sn / 35Ni and other coatings, measured the contact resistance. When the contact pressure ≥ 100 grams, the tin coating has a low contact resistance, and has good reproducibility, the final performance comparable with gold. However, contact pressure <30 grams, the surface of the oxide film is not