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多层电路板的成品率和最终可靠性的一个关键因素是防止由于高温引起的分层。温度的急剧变化以及由此而产生的内应力会造成内层铜与半固化胶片间分层。为保证铜线路与胶片间的结合力和耐热性,多层板生产采用氧化处理已有多年了。层压前铜表面氧化处理是给内层电路图形表面提供一氧化铜结构层。这样处理增加了层压后环氧胶片与铜箔层间的结合力。铜表面的钝化以及因为氧化铜使铜与环氧胶片接触面加大,促使了结合力的改善。对铜与
A key factor in multilayer board yield and ultimate reliability is the prevention of delamination due to high temperatures. Rapid temperature changes and the resultant internal stresses can cause delamination between the inner copper layer and the prepreg. In order to ensure the bonding strength and heat resistance between the copper line and the film, multi-layer board production has been oxidized for many years. The preoxidized copper surface is oxidized to provide a layer of copper monoxide to the inner surface of the circuit pattern. This treatment increases the adhesion between the laminated epoxy film and the copper foil. Passivation of the copper surface and because copper oxide increases the contact area between the copper and the epoxy film contributes to the improvement of the bonding strength. To copper and