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AT&S是Embedded Component Packaging Solutions(嵌入式元件封装解决方案)的领先供应商,其获得专利的ECP(嵌入式组件封装)技术支持进一步缩小封装尺寸同时改进性能。该解决方案显著提高了工业和汽车应用的效率和性能。根据已出产的参考没计显示,电源模块尺寸显著缩小了50%。示例证明,新的嵌入式封装概念通过减少功率损失和降低热阻提高了效率。用于晶圆级电镀的新电镀设备已成功开发,这套设备旨在实现双面铜镀电源模。这催生了面向嵌入式电力没备的新供应链和新的封装解决方案。基于这项积极的发展,来自汽车、工业与半导体工业部门的领军企业如今正努力使这些新封装解决方案实现大规模生产。根据这项大规模生产
AT & S is a leading supplier of Embedded Component Packaging Solutions and its patented ECP (embedded component package) support further reduces package size and improves performance. The solution significantly improves the efficiency and performance of industrial and automotive applications. According to the produced reference did not show that the power module size significantly reduced by 50%. Examples demonstrate that the new embedded package concept increases efficiency by reducing power loss and lowering thermal resistance. New plating equipment for wafer-level electroplating has been successfully developed, which is designed to make double-sided copper-plated power modules. This has spawned new supply chains and new packaging solutions for embedded power supplies. Based on this positive development, leaders from the automotive, industrial and semiconductor industries are now striving to bring these new packaging solutions to mass production. According to this mass production